Thin Film PCB has good thermal and electrical properties, and is an excellent material for power LED packaging. Thin film circuit board is especially suitable for packaging structures such as multi-chip (MCM) and substrate directly bonded chip (COB); it can also be used as other high-power The heat dissipation circuit board of the power semiconductor module.
陶瓷电路板基板是96％氧化铝陶瓷双面覆铜基板，主要用于大功率模块电源，大功率LED照明基板，太阳能光伏基板，大功率微波功率器件等。高导热性，耐高压，耐高温，可焊性。
LED氮化铝陶瓷基板具有优异的性质，例如高导热性，高强度，高电阻率，小密度，低介电常数，无毒以及与Si匹配的热膨胀系数。 LED氮化铝陶瓷基板将逐步取代传统的大功率LED基板材料，成为未来发展最快的陶瓷基板材料。最适合LED氮化铝陶瓷的散热基板
陶瓷基板是指在高温下将铜箔直接粘合到氧化铝（Al2O3）或氮化铝（AlN）陶瓷基板的表面（单面或双面）的特殊处理板。以下是有关多层陶瓷电路板的内容，希望能帮助您更好地了解多层陶瓷电路板的PCB。
